Thin film based structures of an electronic device and a method of making
AssigneeCity University of Hong Kong
InventorsZhengbao Yang, Shiyuan Liu
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Abstract
A method of making a thin film based structure. The method includes (a): forming an electrically conductive layer on a substrate such that the electrically conductive layer is releasably attached to the substrate. The method also includes (b): forming a ceramic or metallic thin film on the electrically conductive layer, on a side opposite the substrate. The electrically conductive layer and the substrate are arranged such that when an interface between them contacts a water-based liquid, the water-based liquid facilitates or causes release of the electrically conductive layer from the substrate, substantially without damaging the substrate.
Claims18
A method of making a thin film based structure, the method comprising steps of:
- forming an electrically conductive layer on a substrate such that the electrically conductive layer is releasably attached to the substrate;
- forming a thin film on the electrically conductive layer, on a side opposite the substrate, wherein, the thin film comprises comprising a ceramic thin film or a metallic thin film;
- forming a support layer on the thin film, on a side opposite the electrically conductive layer;
- and
- contacting an interface between the substrate and the electrically conductive layer with a water-based liquid to facilitate release of the electrically conductive layer from the substrate, substantially without damaging the substrate, thereby forming the thin film base structure.
Dependencies are inferred from the claim text.