Organic vapor jet printing system
AssigneeUniversal Display Corporation
InventorsWilliam E. Quinn, Gregory Mcgraw, Roman Korotkov, Craig Anthony Outten
Life of this patent
Estimating the term…
Abstract
Implementations of the disclosed subject matter provide an organic vapor jet print die including a linear array of depositors, with each of the depositors having a cluster of apertures. The organic vapor jet print die may include at least one first aperture in each cluster of apertures is a delivery aperture that is in fluid communication with a carrier gas source and an evaporation oven. At least one second aperture in each cluster of apertures may be an exhaust aperture in fluid communication with a vacuum reservoir with a static pressure lower than that at the apertures. The delivery apertures and exhaust apertures may have a uniformity that is less than 0.4%.
Claims15
An apparatus comprising:
- an organic vapor jet print die including a linear array of depositors, with each of the depositors having a cluster of apertures, the organic vapor jet print die comprising:
- at least one first aperture in each cluster of apertures is a delivery aperture that is in fluid communication with a carrier gas source and an evaporation oven;
- and
- at least one second aperture in each cluster of apertures is an exhaust aperture in fluid communication with a vacuum reservoir with a static pressure lower than that at the apertures, wherein the delivery aperture and the exhaust aperture have a length nonuniformity that is less than 0.4%,
- wherein the delivery aperture and the exhaust aperture are formed from bonded silicon wafers and a bisection of channels etched into the face of a silicon wafer including a buried oxide layer, and
- wherein the channels that form at least one from the group consisting of:
- the delivery aperture and the exhaust aperture extend completely through one of a silicon layer of a wafer with a buried oxide layer and do not extend into the silicon layer on the other side of the buried oxide layer of that wafer.
Dependencies are inferred from the claim text.