Light-emitting diode packages with selectively placed light-altering materials and related methods

A method comprising:

• providing a light-emitting diode (LED) chip on a submount;
• dispensing a plurality of droplets of light-altering material proximate the LED chip on the submount, each droplet of the plurality of droplets being spaced apart from other droplets of the plurality of droplets proximate the LED chip;
• allowing the plurality of droplets of light-altering material to wick along a surface of the submount and along peripheral edges of the LED chip, the light altering material comprising a light-reflective material;
• and
• curing the light-altering material.

A light-emitting diode (LED) package comprising:

• a submount;
• at least one LED chip on the submount, the at least one LED chip including a first side, a second side that is mounted to the submount, and peripheral edges that bound the first side and the second side;
• a lumiphoric material on the first side and on the peripheral edges of the at least one LED chip;
• and
• a light-altering material directly on a top surface and directly on a side surface of the lumiphoric material relative to the submount, the light-altering material being proximate the peripheral edges of the at least one LED chip such that peripheral edges of the light-altering material are arranged in positions that are between peripheral edges of the submount and the at least one LED chip, the light-altering material comprising a light-reflective material.