Manufacturing method of light-emitting device with quantum dots
AssigneeQdlux Inc.
InventorsJung-Hua Chang, Ching-Liang Yi, Chen-Yang Huang
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Abstract
An optical part includes a quantum dot film layer, a lower transparent film layer, and an outer protective film. The quantum dot film layer includes an upper surface, a lower surface, and a lateral surface. The lateral surface connects the upper surface with the lower surface, and the quantum dot film layer is a film containing light emitting semiconductor nanoparticles. The lower transparent film layer is disposed on the lower surface of the quantum dot film layer. The outer protective film directly or indirectly covers the upper surface of the quantum dot film layer, and extends to cover the lateral surface of the quantum dot film layer.
Claims4
A manufacturing method of a light-emitting device with quantum dots, comprising:
- providing a base layer;
- disposing a quantum dot film layer above the base layer, wherein a lower transparent film layer is disposed on a lower surface of the quantum dot film layer;
- cutting the quantum dot film layer and the lower transparent film layer to form a plurality of optical part units;
- and
- forming an outer protective film to cover one lateral surface of each of the optical part units and directly or indirectly completely cover an upper surface of the quantum dot film layer to form a plurality of optical parts and transferring each of the optical parts to a plurality of light-emitting diode chips on one substrate.
Dependencies are inferred from the claim text.