Packages and processes for radio frequency mitigation and self-test
AssigneeApple Inc.
InventorKrishna Prasad Vummidi Murali
Life of this patent
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AssigneeApple Inc.
InventorKrishna Prasad Vummidi Murali
Estimating the term…
A semiconductor component package includes circuitry that can be used both for mitigating radio-frequency interference of signals in the package and for performing self-test procedures of components in the package. The circuitry includes chokes between the I/O pads of the package and a sensor module in the package to attenuate high-frequency RF interference in the package and protect sensors in the package. Each I/O pad may have a corresponding choke. During a self-test procedure, such as a test of a sensor's temperature coefficient of offset, the chokes can be decoupled from the I/O pads and the sensor module and coupled between a current source and a ground. A current can be supplied to the choke to raise the temperature of the package. The chokes may use high-resistance windings to increase heat generation during the self-test procedure.
An electronic device, comprising:
Dependencies are inferred from the claim text.