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US 12,742,962 B2Granted
Optical device, subassembly of optical device, and method of manufacturing optical device
AssigneeFurukawa Electric Co., Ltd.
InventorsAtsushi Izawa, Kazuya Nagashima, Yozo Ishikawa, Yusuke Inaba, Takuya Kokawa
Life of this patent
Estimating the term…
Abstract
An optical device includes: a case; a wiring substrate that passes through the case and that includes an insulating member and a conductor; at least one of components including a first component configured to perform at least one of: outputting a light; receiving a light; and varying optical properties, and a second component configured to electrically control the first component, the at least one of components being housed in the case and flip-chip mounted on the wiring substrate.
Claims8
An optical device comprising:
- a case that includes a first wall and a second wall that intersects with the first wall;
- a wiring substrate that is a flexible substrate, that passes through the first wall and that includes an insulating member and a conductor;
- at least one of components including
- a first component configured to perform at least one of:
- outputting a light;
- receiving a light;
- and varying optical properties, and
- a second component configured to electrically control the first component,
- the at least one of components being housed in the case and flip-chip mounted on the wiring substrate;
- and
- a heat transferring member that passes through the first wall, supports the wiring substrate at a position that the wiring substrate passes through the first wall, and is arranged between the at least one of components and the second wall, the heat transferring member thermally connecting the at least one of components and the second wall.
8 more elements
An optical device comprising:
- a case;
- a wiring substrate that is a flexible substrate, that passes through the case and that includes an insulating member and a conductor;
- at least one of components including:
- a first component configured to perform at least one of:
- outputting a light;
- receiving a light;
- and varying optical properties, and
- a second component configured to electrically control the first component,
- the at least one of components being housed in the case and flip-chip mounted on the wiring substrate;
- and
- a supporting member that passes through the case and that supports the wiring substrate at a position that the wiring substrate passes through the case, wherein
- the wiring substrate passes through an opening formed on the case, and
- the optical device further comprises a junction material configured to bond an edge of the opening and the wiring substrate.
10 more elements
A subassembly of an optical device having a case, comprising:
- a wiring substrate that is a flexible substrate, that passes through the case through an opening formed on the case and that includes an insulating member and a conductor;
- at least one of components including
- a first component configured to perform at least one of:
- outputting a light;
- receiving a light;
- and varying optical properties, and
- a second component configured to electrically control the first component,
- the at least one of components being housed in the case and flip-chip mounted on the wiring substrate;
- a supporting member that passes through the case and that supports the wiring substrate at a position that the wiring substrate passes through the case;
- and
- a junction material configured to bond an edge of the opening and the wiring substrate, wherein
- the subassembly of the optical device is configured to be attachable to the case and the at least one of the components is positioned on an opposite side to an outer face of the case with reference to the wall.
9 more elements
A subassembly of an optical device having a case, comprising:
- a first portion that is a portion of the case for housing an optical component, the first portion including a first wall;
- a wiring substrate that is a flexible substrate, that includes an insulating member and a conductor and that is fixed to the first wall in a state in which the wiring substrate has passed through the first wall through an opening formed on the first wall;
- at least one of components including
- a first component configured to perform at least one of:
- outputting a light;
- receiving a light;
- and varying optical properties, and
- a second component configured to electrically control the first component,
- the at least one of components being mounted on the wiring substrate, and positioned on an opposite side to an outer face of the case with respect to the first wall;
- and
- a supporting member that passes through the first wall and that supports the wiring substrate at a position that the wiring substrate passes through the first wall, and
- a junction material configured to bond an edge of the opening and the wiring substrate, wherein
- the subassembly of the optical device is configured to be attachable to a second portion of the case that is different from the first portion.
10 more elements
A method of manufacturing an optical device, the method comprising:
- preparing a subassembly by mounting, on a wiring substrate, at least one of components including:
- a first component configured to perform at least one of:
- outputting a light;
- receiving a light;
- and varying optical properties;
- and a second component configured to electrically control the first component;
- and
- fixing the subassembly and a case of the optical device to each other in a state in which the wiring substrate passes through an opening formed on a wall of the case, and the at least one of components is positioned on an opposite side to an outer face of the case with respect to the wall, wherein
- the wiring substrate is a flexible substrate,
- a supporting member passes through the case and supports the wiring substrate at a position that the wiring substrate passes through the case, and
- a junction material bonds an edge of the opening and the wiring substrate.
8 more elements
Dependencies are inferred from the claim text.