Heat sink for electronic component and associated manufacturing method

Abstract

A heat sink for an electronic component and its manufacturing method by applying a nanopulsed laser. The heat sink includes a body provided with an outer layer, including a surface layer having a radiative exposed surface and a layer immediately underlying the surface layer. The underlying layer is made of a material based on a metal and the surface layer is made of an oxide of said material. The outer layer includes juxtaposed nodules. The heat sink originally combines a surface chemical state promoting heat emission and a structure geometrically promoting heat exchange, in order to synergistically improve its heat dissipation capability.

Dependencies are inferred from the claim text.