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US 12,742,105 B2Granted
Adhesive, rotary electric machine, electronic component, and aircraft
AssigneeMitsubishi Electric Corporation
InventorYoshiyuki Kamo
Life of this patent
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Abstract
A stress relaxation type adhesive is formed such that an epoxy-based base adhesive is formed with an epoxy compound having two or more allyl groups as functional groups, as a main agent, using an amine-based curing agent having a bisphenol A type resin backbone, and at least one of an ethylene-acrylic copolymer and an ethylene-propylene copolymer each having an average particle diameter of 10 μm or less is contained as a stress relaxation agent in a range of 20 wt % or less with respect to the base adhesive.
Claims9
An adhesive wherein
- an epoxy-based base adhesive is formed with an epoxy compound having two or more allyl groups as functional groups, as a main agent, using an amine-based curing agent having a backbone include a bisphenol A resin, and
- at least one of an ethylene-acrylic copolymer and an ethylene-propylene copolymer each having an average particle diameter of 10 μm or less is contained as a stress relaxation agent in a range of 20 wt % or less with respect to the base adhesive.
Dependencies are inferred from the claim text.