Energy saving, low temperature curable, pumpable, structural adhesive compositions for use in automotive body-in-white (BIW) applications

A one-component curable structural adhesive composition which cures to form a cured product, comprising:

• a bisphenol A liquid epoxy resin, wherein the bisphenol A liquid epoxy resin is present from approximately 15 percent to approximately 40 percent of the total weight of the composition;
• a bisphenol F liquid epoxy resin, wherein the bisphenol F liquid epoxy resin is present from approximately 5 percent to approximately 20 percent of the total weight of the composition;
• a bisphenol A solid epoxy resin, wherein the bisphenol A solid epoxy resin is present from approximately 5 percent to approximately 20 percent of the total weight of the composition;
• a first toughening agent, wherein the first toughening agent comprises an epoxy terminated polyurethane interpenetrating network present from approximately 10 percent to approximately 25 percent of the total weight of the composition;
• a second toughening agent, wherein the second toughening agent is present from approximately 10 percent to approximately 25 percent of the total weight of the composition;
• one or more filler materials, wherein the filler material(s) is present from approximately 5 percent to approximately 15 percent of the total weight of the composition;
• a substrate wetting agent, wherein the substrate wetting agent is present from approximately 0.5 percent to approximately 5 percent of the total weight of the composition;
• a corrosion inhibiting agent, wherein the corrosion inhibiting agent is present from approximately 5 percent to approximately 10 percent of the total weight of the composition;
• an amine curing agent, wherein the amine curing agent is present from approximately 2 percent to approximately 10 percent of the total weight of the composition;
• a modified imidazole curing agent, wherein the modified imidazole curing agent is present from approximately 0.5 percent to approximately 2 percent of the total weight of the composition;
• a first accelerating agent, wherein the first accelerating agent is present from approximately 0.5 percent to approximately 2 percent of the total weight of the composition;
• a second accelerating agent, wherein the second accelerating agent is present from approximately 0.5 percent to approximately 2 percent of the total weight of the composition;
• a rheology modifier, wherein the rheology modifier is present from approximately 0.5 percent to approximately 2 percent of the total weight of the composition;
• a thixotropic agent, wherein the thixotropic agent is present from approximately 2 percent to approximately 10 percent of the total weight of the composition;
• a pigment, wherein the pigment is present from approximately 0.05 percent to approximately 1 percent of the total weight of the composition;
• and
• a silane adhesion promoter, wherein the silane adhesion promoter is present from approximately 0.5 percent to approximately 2 percent of the total weight of the composition.

A one-component curable structural adhesive composition which cures to form a cured product, comprising:

• a bisphenol A liquid epoxy resin;
• a bisphenol F liquid epoxy resin;
• a bisphenol A solid epoxy resin, wherein the bisphenol A solid epoxy resin comprises a bisphenol A unmodified solid epoxy resin present from approximately 5 percent to approximately 20 percent of the total weight of the composition;
• a first toughening agent;
• a second toughening agent;
• at least one filler material;
• a substrate wetting agent;
• a corrosion inhibiting agent;
• an amine curing agent;
• a modified imidazole curing agent;
• an accelerating agent;
• a silane adhesion promoter;
• and
• wherein the structural adhesive composition is low energy curable, and the cured product is crash durable and exhibits high wash resistance.