Encapsulation film
AssigneeLG Chem, Ltd.
InventorsSeung Min Lee, Yeong Bong Mok, Sung Nam Moon, Sang Min Park, Hyun Suk Kim
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Abstract
The present application relates to an encapsulation film, an organic electronic device comprising the same, and a method for manufacturing an organic electronic device using the same, which provides an encapsulation film having excellent reliability that allows forming a structure capable of blocking moisture or oxygen flowing into an organic electronic device from the outside, absorbs and disperses the stress according to panel bending, while preventing generation of bright spots in the organic electronic device.
Claims16
An encapsulation film comprising an encapsulation layer and a protective layer formed on the encapsulation layer,
- wherein the protective layer has a coefficient of positive linear thermal expansion (CTE) in machine direction (MD) measured according to American Society for Testing and Materials (ASTM) E831 standard in a range of 6 to 30 ppm/° C.,
- wherein the encapsulation layer comprises an encapsulation resin,
- wherein the encapsulation resin is included in the encapsulation layer in an amount of 40 wt % or more, and
- wherein the encapsulation layer has a creep shear strain value of less than 150% as measured, in a state laminated by laminating it to a film sample having a thickness within a range of 750 to 850 μm, after applying to the film sample a vertical force of 200 gf at 85° C. using an 8 mm aluminum parallel plate cell in the Creep mode with ARES (TA) to load the film sample, and applying a shear stress of 15,000Pa to the laminated film sample and maintaining it for 60 seconds,
- wherein the encapsulation layer further comprises a tackifier, and
- wherein the tackifier is a compound containing a cyclic structure having a carbon number in a range of 7 to 13, and the cyclic structure is a bicyclic or tricyclic compound.
Dependencies are inferred from the claim text.