Method for manufacturing polyimide film with reduced gloss

A method for manufacturing a polyimide film with a reduced gloss, comprising:

• providing a diamine and a diacid anhydride for polymerization in a solvent to form a polyimide precursor solution, wherein the diamine includes 10-45 mol % of 4,4′-diaminodiphenyl ether (4,4′-ODA) and 90-55 mol % of p-phenylenediamine (p-PDA) based on a total amount of the diamine, the diacid anhydride includes 10-50 mol % of pyromellitic dianhydride (PMDA) and 90-50 mol % of 3,3′,4,4′-biphenyltetracarboxylic dianhydride (BPDA) based on a total amount of the diacid anhydride;
• adding 2-5 equivalents of a dehydrating agent and a catalyst into the polyimide precursor solution and then coating a carrier with the polyimide precursor solution to form a polyimide gel film, which has a Young's modulus of 230-350 Kgf/mm2, wherein the dehydrating agent is an aliphatic acid anhydride and/or an aromatic acid anhydride;
• providing an embossing wheel to roll the polyimide gel film peeled from the carrier at a temperature of 140-200° C and a pressure of 3-10 Kgf/cm2 to form a concave and convex shape on a surface of the polyimide gel film;
• and
• baking the polyimide gel film to form a polyimide film with a 60° gloss of less than 100 GUs.