Thermal conditioning circuit
AssigneeValeo Systemes Thermiques
InventorsLaurent Delaforge, Thibaut Perrin, Rody El Chammas, Muriel Porto
Life of this patent
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Abstract
The invention relates to a thermal conditioning system including a refrigerant circuit having: a main loop including in succession: a compression device, a condenser configured to exchange heat with a first heat transfer fluid, a first expansion device, a first evaporator, a bypass branch including a second expansion device and a second evaporator. The second expansion device is a thermostatic expansion valve configured to vary a flow area for the refrigerant between a minimum flow area and a maximum flow area. The bypass branch includes a flow restriction device configured to limit a flow area for the refrigerant to a value less than the maximum flow area of the second expansion device.
Claims16
A thermal conditioning system comprising a refrigerant circuit configured to circulate a refrigerant, the refrigerant circuit including:
- a main loop including in succession in the direction of travel of the refrigerant:
- a compressor,
- a condenser configured to exchange heat with a first heat transfer fluid,
- a first expansion device,
- a first evaporator,
- a bypass branch connecting a first junction point positioned on the main loop downstream of the condenser and upstream of the first expansion device to a second junction point positioned on the main loop downstream of the first evaporator and upstream of the compressor, the bypass branch including a second expansion device and a second evaporator,
- wherein the second expansion device is a thermostatic expansion valve configured to vary a flow area for the refrigerant between a minimum flow area and a maximum flow area,
- wherein the bypass branch includes a flow restriction device configured to limit a flow area for the refrigerant to a value less than the maximum flow area of the second expansion device,
- wherein the second expansion device includes a first refrigerant circulation duct configured to supply the refrigerant to the second evaporator and a second refrigerant circulation duct configured to receive the refrigerant at the outlet of the second evaporator, the second expansion device including a movable shut-off device configured to vary a flow area of the first refrigerant circulation duct under the action of a thermally sensitive element positioned in the second refrigerant circulation duct, and wherein the flow restriction device is positioned in the second refrigerant circulation duct.
A thermal conditioning system comprising a refrigerant circuit configured to circulate a refrigerant, the refrigerant circuit including:
- a main loop including in succession in the direction of travel of the refrigerant:
- a compressor,
- a condenser configured to exchange heat with a first heat transfer fluid,
- a first expansion device,
- a first evaporator,
- a bypass branch connecting a first junction point positioned on the main loop downstream of the condenser and upstream of the first expansion device to a second junction point positioned on the main loop downstream of the first evaporator and upstream of the compressor, the bypass branch including a second expansion device and a second evaporator,
- wherein the second expansion device is a thermostatic expansion valve configured to vary a flow area for the refrigerant between a minimum flow area and a maximum flow area,
- wherein the bypass branch includes a flow restriction device that is a diaphragm including a calibrated orifice configured to limit a flow area for the refrigerant to a value less than the maximum flow area of the second expansion device.
A thermal conditioning system comprising a refrigerant circuit configured to circulate a refrigerant, the refrigerant circuit including:
- a main loop including in succession in the direction of travel of the refrigerant:
- a compressor,
- a condenser configured to exchange heat with a first heat transfer fluid,
- a first expansion device,
- a first evaporator,
- a bypass branch connecting a first junction point positioned on the main loop downstream of the condenser and upstream of the first expansion device to a second junction point positioned on the main loop downstream of the first evaporator and upstream of the compressor, the bypass branch including a second expansion device, a second evaporator, and a flow restriction device that is a diaphragm including a calibrated orifice configured to limit a flow area for the refrigerant to a value less than the maximum flow area of the second expansion device,
- a hose connected to the second expansion device, the hose including a flange for connection with the second expansion device, wherein the flange includes a recess for receiving the diaphragm, the diaphragm being positioned in the receiving recess,
- wherein the second expansion device is a thermostatic expansion valve configured to vary a flow area for the refrigerant between a minimum flow area and a maximum flow area.
Dependencies are inferred from the claim text.