Cleaning system and method for a curved substrate

A curved target substrate cleaning system, comprising:

• a pressure-type cleaning unit for cleaning a cleaning area of a target substrate having a curved portion by applying pressure such that the curvature of the target substrate's surface varies according to the position on the surface;
• a support body detachably supporting the pressure-type cleaning unit at a predetermined height with respect to the cleaning area of the target substrate having the curved portion;
• a cleaning area flat maintenance unit that clamps one end of the target substrate having the curved portion and adjusts a height of the curved portion to maintain the cleaning area of the target substrate in a predetermined orientation with respect to the pressure-type cleaning unit;
• and
• a moving unit that moves the cleaning area flat maintenance unit back and forth in one direction with respect to the pressure-type cleaning unit.