Semiconductor package and method of fabricating semiconductor package

A semiconductor package, comprising:

• a substrate;
• a first die disposed on the substrate;
• a second die, disposed on the first die and over the substrate, wherein a span of the first die is larger than a span of the second die, and the first die has a first thickness larger than a second thickness of the second die;
• a first dielectric resistant layer, disposed on the first and second dies and conformally covering the first and second dies;
• a first encapsulant, disposed on the first dielectric resistant layer and covering and wrapping around the first and second dies;
• and
• a first interlink structure, disposed above the first and second dies and embedded in the first encapsulant and electrically connected with the first and second dies, wherein the first interlink structure includes a first via portion vertically extending through the first encapsulant and connected to the first die, and a second via portion extending vertically through the first encapsulant and connected to the second die, and the first via portion is longer than the second via portion.

A semiconductor package, comprising:

• a substrate;
• a first die and a second die disposed on the substrate, wherein the first die is located beside and spaced apart from the second die, and the first die has a first thickness different from a second thickness of the second die;
• a resistant layer, disposed on the first and second dies and conformally covering the first and second dies;
• an encapsulant, disposed on the resistant layer and wrapping around the first and second dies;
• and
• an interlink structure, disposed above the first and second dies and embedded in the encapsulant, and electrically connected with the first and second dies, wherein the interlink structure includes a first via portion vertically extending through the encapsulant and connected to the first die, a second via portion extending vertically through the encapsulant and connected to the second die, and a routing line portion disposed on and connected with the first and second via portions, a first dimension of the first via portion in a vertical thickness direction is different from a second dimension of the second via portion in the vertical thickness direction.