Alignment mark and imprinting method

An imprinting method using an alignment mark, the alignment mark including:

• a first mark that is arranged in a first film having optical transparency of a first substrate on which a device is manufactured;
• a second mark that is arranged in a second substrate having a first pattern to be transferred to the first substrate side, and is used for alignment with the first mark;
• and
• a second pattern that is arranged in at least any of the first and second substrates at a position overlapping a peripheral region of the first mark when viewed from the second substrate side, the first substrate and the second substrate being arranged at positions where the first and second marks vertically overlap each other, the second pattern having a random dimensional distribution,
• the imprinting method comprising:
• arranging the first substrate and the second substrate at positions where the first and second marks vertically overlap each other;
• and
• performing alignment of the first substrate and the second substrate while observing the first and second marks from the second substrate side, and then transferring the second pattern to the first substrate side.

An alignment mark comprising:

• a first mark that is arranged in a first film having optical transparency of a first substrate on which a semiconductor device is manufactured;
• a second mark that is arranged in a second substrate having a first pattern to be transferred to the first substrate side, and is used for alignment with the first mark;
• and
• a second pattern that is arranged in at least any of the first and second substrates at a position overlapping a peripheral region of the first mark when viewed from the second substrate side, the first substrate and the second substrate being arranged at positions where the first and second marks vertically overlap each other,
• wherein the second pattern has
• a first line-and-space pattern extending in a first direction along the first film,
• a second line-and-space pattern extending in a second direction that is along the first film and intersects the first direction,
• in the first line-and-space pattern, each of a line width, a pitch between lines, a space width, a pitch between spaces in the second direction varies by taking a dispersed value, and
• in the second line-and-space pattern, each of a line width, a pitch between lines, a space width, a pitch between spaces in the first direction varies by taking a dispersed value.

An imprinting method using an alignment mark, the alignment mark including:

• a first mark that is arranged in a first film having optical transparency of a first substrate;
• a second mark that is arranged in a second substrate having a first pattern to be transferred to the first substrate side, and is used for alignment with the first mark;
• and
• a second pattern that is arranged in at least any of the first and second substrates at a position overlapping a peripheral region of the first mark, when viewed from the second substrate side, the first substrate and the second substrate being arranged at positions where the first and second marks vertically overlap each other, the second pattern having
• a first line-and-space pattern extending in a first direction along the first film,
• a second line-and-space pattern extending in a second direction that is along the first film and intersects the first direction,
• in the first line-and-space pattern, each of a line width, a pitch between lines, a space width, a pitch between spaces in the second direction varies by taking a dispersed value, and
• in the second line-and-space pattern, each of a line width, a pitch between lines, a space width, a pitch between spaces in the first direction varies by taking a dispersed value,
• the imprinting method comprising:
• arranging the first substrate and the second substrate at positions where the first and second marks vertically overlap each other;
• and
• performing alignment of the first substrate and the second substrate while observing the first and second marks from the second substrate side, and then transferring the second pattern to the first substrate side.