Semiconductor device

A semiconductor device comprising:

• a first semiconductor chip;
• a second semiconductor chip;
• and
• a redistribution layer,
• wherein the first semiconductor chip and the second semiconductor chip are arranged spaced apart from each other in a second direction orthogonal to a first direction,
• wherein the first direction is a thickness direction of the semiconductor device,
• wherein the redistribution layer is disposed over the first semiconductor chip and the second semiconductor chip in the first direction so as to extend across the first semiconductor chip and the second semiconductor chip,
• wherein the redistribution layer includes a first inductor and a second inductor,
• wherein the first inductor and the second inductor are spaced apart and face each other in a third direction orthogonal to the first direction and the second direction,
• wherein the first inductor is electrically connected to the first semiconductor chip,
• wherein the second inductor is electrically connected to the second semiconductor chip, and
• wherein the first inductor and the second inductor are disposed over the first semiconductor chip and the second semiconductor chip and wound in a plane orthogonal to the third direction.