Semiconductor device and method of forming AIP structure to reduce signal interference among and between encapsulant blocks

Abstract

A semiconductor device has a substrate and an electrical component disposed over a first surface of the substrate. An antenna is disposed over a second surface of the substrate. An absorbing material is disposed over the second surface of the substrate around the antenna. The absorbing material is thin and flexible to be workable over the second surface of the substrate. The absorbing material has a plurality of openings to accommodate the antenna and the antenna extends above the absorbing material. A first encapsulant can be deposited over the antenna and second surface of the substate prior to the absorbing material. A second encapsulant is deposited over the electrical component. A shielding material is disposed over the encapsulant and electrical component. An electrical connector is disposed over the first surface of the substrate. The substrate, electrical component, first encapsulant, second encapsulant, shielding material, and electrical connector constitute an antenna-on-package.

Dependencies are inferred from the claim text.