Subtractive lines and vias with wrap-around contact
AssigneeInternational Business Machines Corporation
InventorsNicholas Anthony Lanzillo, Lawrence A. Clevenger, Brent A. Anderson, Albert M. Chu, Reinaldo Vega, Ruilong Xie
Life of this patent
Estimating the term…
Abstract
An interconnect structure for connecting an upper wiring line to a lower wiring line includes a via connecting a lower portion of the upper wiring line with an upper surface of the lower wiring line and a wrap-around via portion formed integrally with the via, the wrap-around portion extending along and electrically contacting a portion of the sides of the lower wiring line.
Claims14
An interconnect structure for connecting an upper wiring line to a lower wiring line, comprising:
- a via connecting a lower portion of the upper wiring line with an upper surface of the lower wiring line;
- an adhesive layer located along a portion of the lower wiring line;
- a dielectric layer located around the lower wiring line, wherein the adhesive layer is located between the dielectric layer and the lower wiring line;
- and
- a wrap-around via portion formed integrally with the via, the wrap-around via portion extending along and electrically contacting a portion of a vertical side surface of the lower wiring line, wherein the wrap-around via portion is in direct contact with the adhesive layer, the dielectric layer, and the lower wiring line.
An interconnect structure for connecting an upper wiring line to a lower wiring line, comprising:
- a damascene via connecting a lower portion of the upper wiring line with an upper surface of the lower wiring line and an upper surface of an adhesive layer on sides of the lower wiring line, wherein the adhesive layer is in direct contact with the lower wiring line;
- a dielectric layer located around the lower wiring line, wherein the adhesive layer is located between the dielectric layer and the lower wiring line;
- and
- a wrap-around via portion formed integrally with the damascene via, the wrap-around portion extending along and electrically contacting a portion of a vertical side surface of the lower wiring line, wherein the wrap-around via portion is in direct contact with the adhesive layer, the dielectric layer, and the lower wiring line.
Dependencies are inferred from the claim text.