Thermoelectric conversion module

A thermoelectric conversion module, comprising:

• an insulating substrate including an electrode surface on which a plurality of first electrodes are directly disposed, the insulating substrate being a single layer structure;
• a plurality of second electrodes facing the plurality of first electrodes;
• a plurality of thermoelectric elements respectively disposed between the plurality of first electrodes and the plurality of second electrodes and including P-type thermoelectric elements and N-type thermoelectric elements alternately connected in series by the plurality of first electrodes and the plurality of second electrodes;
• a cover portion that seals the plurality of second electrodes and the plurality of thermoelectric elements on the electrode surface of the insulating substrate, the cover portion including a housing portion integrally formed with a flange portion, the housing portion extending to a first height above the insulating substrate, and the flange portion extending to a second height lower than the first height above the insulating substrate;
• a bonding member formed of a resin and bonding the electrode surface of the insulating substrate and the flange portion of the cover portion to each other in an airtight manner;
• and
• a pair of terminal electrodes disposed directly on the electrode surface of the insulating substrate and respectively extending from a pair of first electrodes, among the plurality of first electrodes, through the bonding member to outside the cover portion such that the pair of terminal electrodes are disposed directly on the electrode surface of the insulating substrate outside the cover portion, the pair of first electrodes constituting both ends of the series connection of the plurality of thermoelectric elements, wherein:
• the bonding member is disposed directly on both of the electrode surface of the insulating substrate and the pair of terminal electrodes only, and
• the flange portion of the cover portion, integrally formed with the housing portion of the cover portion, is disposed directly on the bonding member that is disposed directly on both of the electrode surface of the insulating substrate and the pair of terminal electrodes only.