Method of manufacturing flexible substrate
AssigneeShenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
InventorLinshuang Li
Life of this patent
Estimating the term…
Abstract
Disclosed is a method of manufacturing a flexible substrate. The method includes: forming a first flexible substrate on a glass substrate; forming a porous film layer on the first flexible substrate; forming a second flexible substrate on the porous film layer, wherein the porous film layer is configured to increase adhesion between the first flexible substrate and the second flexible substrate; and separating the first flexible substrate from the glass substrate.
Claims15
A method of manufacturing a flexible substrate, comprising:
- forming a first flexible substrate on a glass substrate;
- forming a porous film layer on the first flexible substrate;
- forming a second flexible substrate on the porous film layer, wherein the porous film layer is configured to increase adhesion between the first flexible substrate and the second flexible substrate;
- and
- separating the first flexible substrate from the glass substrate,
- wherein a material of the porous film layer comprises polyimide/inorganic nanohybrid material.
A method of manufacturing a flexible substrate, comprising:
- forming a first flexible substrate on a glass substrate;
- forming a porous film layer on the first flexible substrate;
- forming a second flexible substrate on the porous film layer, wherein the porous film layer is configured to increase adhesion between the first flexible substrate and the second flexible substrate;
- and
- separating the first flexible substrate from the glass substrate,
- wherein the porous film layer comprises a molecular chain structure comprising ether bonds and siloxane segments.
Dependencies are inferred from the claim text.