Electronic substrate and electronic device

An electronic substrate, comprising:

• a base substrate;
• and
• at least one first signal line and at least one second signal line on the base substrate,
• wherein the electronic substrate comprises a first functional region and a peripheral region at least partially surrounding the first functional region, and the first signal line and the second signal line are in the peripheral region and at least partially surround the first functional region;
• the first signal line and the second signal line are spaced apart from each other and insulated from each other;
• at least one of the first signal line and the second signal line is configured to transmit an electrical signal for the first functional region;
• in a direction perpendicular to the base substrate, the first signal line partially overlaps with the second signal line in an overlapping region;
• and
• the first signal line comprises a first wiring portion in the overlapping region and a second wiring portion outside the overlapping region,
• the second signal line comprises a third wiring portion in the overlapping region and a fourth wiring portion outside the overlapping region,
• wherein a line width of the first wiring portion is different from a line width of the second wiring portion, wherein
• the electronic substrate further comprises a first conductive layer, an insulating layer, and a second conductive layer,
• the first conductive layer, the insulating layer, and the second conductive layer are on the base substrate and are stacked with each other,
• the insulating layer is between the first conductive layer and the second conductive layer, and the first conductive layer and the second conductive layer are spaced apart and insulated from each other in the direction perpendicular to the base substrate by the insulating layer,
• the first wiring portion is in the first conductive layer, and
• the second wiring portion comprises a first sub-portion in the first conductive layer and a second sub-portion in the second conductive layer, and the first sub-portion of the second wiring portion is electrically connected to the second sub-portion of the second wiring portion through a via hole structure at least penetrating the insulating layer.