Electronic device member and electronic devices
AssigneeTDK Corporation
InventorsMaiko Kokubo, Shinji Hara, Naoki Ohta, Susumu Aoki
Life of this patent
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Abstract
Electronic device member comprises a first substrate, at least one protruding portion that protrudes from the first substrate, and a solder layer, wherein the at least one protruding portion includes at least one side surface, a tip surface, and a connection portion between the at least one side surface and the tip surface, and wherein the solder layer is in contact with the tip surface. At the connection portion, the at least one side surface and the tip surface form obtuse angle.
Claims8
An electronic device member comprising a first substrate, at least one protruding portion that protrudes from the first substrate, and a solder layer,
- wherein the at least one protruding portion comprises at least one side surface, a tip surface, and a connection portion between the at least one side surface and the tip surface,
- wherein the solder layer is in contact with the tip surface, and
- wherein the at least one side surface and the tip surface form an obtuse angle at the connection portion.
Dependencies are inferred from the claim text.