Backside conducting lines in integrated circuits

A method comprising:

• fabricating a first-type active-region structure and a second-type active-region structure extending in a first direction on a substrate;
• fabricating a first boundary isolation region in the first-type active-region structure and a second boundary isolation region in the second-type active-region structure, wherein a vertical boundary extending in a second direction passes through the first boundary isolation region and the second boundary isolation region, and wherein the second direction is perpendicular to the first direction;
• fabricating a backside horizontal conducting line extending in the first direction in a backside first conducting layer below the substrate, wherein the backside horizontal conducting line extends across the vertical boundary;
• fabricating a pin-connector that is connected to the backside horizontal conducting line;
• and
• fabricating a backside vertical conducting line extending in the second direction in a backside second conducting layer below the backside first conducting layer, wherein the backside vertical conducting line is adjacent to the vertical boundary, and wherein the pin-connector is directly connected between the backside horizontal conducting line and the backside vertical conducting line at an overlap region between the backside horizontal conducting line and the backside vertical conducting line.

A method comprising:

• fabricating a first-type active-region structure and a second-type active-region structure extending in a first direction on a substrate;
• fabricating a first boundary isolation region in the first-type active-region structure and a second boundary isolation region in the second-type active-region structure, wherein a vertical boundary extending in a second direction passes through the first boundary isolation region and the second boundary isolation region, and wherein the second direction is perpendicular to the first direction;
• fabricating a backside horizontal conducting line extending in the first direction in a backside first conducting layer below the substrate;
• fabricating a pin-connector that is connected to the backside horizontal conducting line;
• and
• fabricating a backside vertical conducting line extending in the second direction in a backside second conducting layer below the backside first conducting layer, wherein the backside vertical conducting line is adjacent to the vertical boundary and includes a first portion and a second portion, and wherein a first width of the first portion along the first direction is larger than a second width of the second portion along the first direction, and wherein the pin-connector is directly connected between the backside horizontal conducting line and the first portion of the backside vertical conducting line.