Polycrystalline silicon carbide substrate with density gradient and method of manufacturing the same
AssigneeSTMicroelectronics International N.V.
InventorsBjörn Magnusson Lindgren, Carlo Riva
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AssigneeSTMicroelectronics International N.V.
InventorsBjörn Magnusson Lindgren, Carlo Riva
Estimating the term…
A polycrystalline silicon carbide (SiC) substrate with a density gradient between a first side of the polycrystalline SiC substrate and a second side of the polycrystalline SiC substrate opposite to the first side. A first density at the first side of the polycrystalline SiC substrate is less than a second density at the second side of the polycrystalline SiC substrate. The polycrystalline SiC substrate with the density gradient may be formed by forming a polycrystalline SiC base substrate with a sintering process followed by a post-sintering process. For example, the post sintering process may be at least one of the following of: applying a first temperature to the first side and a second temperature to the second side of the polycrystalline SiC substrate and performing a chemical vapor deposition (CVD) process to impregnate further silicon (Si) and carbon (C) atoms into the polycrystalline SiC base substrate.
A device, comprising:
A method, comprising:
A method, comprising:
Dependencies are inferred from the claim text.