Component cooler with multiple fluid paths
AssigneeAdvanced Micro Devices, Inc.
InventorsChristopher M. Jaggers, Robert Edward Radke, Christopher M. Helberg
Life of this patent
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Abstract
An apparatus for component cooling includes a first heat transfer element configured to be thermally coupled to a heat-generating component and a second heat transfer element configured to be thermally coupled to the heat-generating component. A manifold is configured to receive a single fluid flow of a heat transfer medium and split the single fluid flow into a first split fluid flow provided to the first heat transfer element and a second split fluid flow provided to the second heat transfer element.
Claims20
An apparatus for component cooling, the apparatus comprising:
- a first heat transfer element configured to be thermally coupled to a heat-generating component, wherein the first heat transfer element comprises a first cold plate;
- a second heat transfer element configured to be thermally coupled to the heat-generating component, wherein the second heat transfer element comprises a second cold plate separate from the first cold plate, wherein the first cold plate and the second cold plate each comprise a respective fluid passage extending therethrough;
- a heat transfer structure thermally coupled between the first heat transfer element and the second heat transfer element and configured to provide a heat conduction path from the first heat transfer element to the second heat transfer element;
- and
- a manifold configured to receive a single fluid flow of a heat transfer medium and split the single fluid flow into a first split fluid flow provided to the first heat transfer element and a second split fluid flow provided to the second heat transfer element.
A component cooling assembly comprising:
- an integrated circuit;
- a first heat transfer element thermally coupled to the integrated circuit, wherein the first heat transfer element comprises a first cold plate;
- a second heat transfer element thermally coupled to the integrated circuit, wherein the second heat transfer element comprises a second cold plate separate from the first cold plate, wherein the first cold plate and the second cold plate each comprise a respective fluid passage extending therethrough;
- a heat transfer structure thermally coupled between the first heat transfer element and the second heat transfer element and configured to provide a heat conduction path from the first heat transfer element to the second heat transfer element;
- and
- a manifold configured to receive a single fluid flow of a heat transfer medium and split the single fluid flow into a first split fluid flow provided to the first heat transfer element and a second split fluid flow provided to the second heat transfer element.
A manifold for a component cooling apparatus, the manifold comprising:
- a manifold inlet configured to receive a single fluid flow of a heat transfer medium;
- a first fluid passage and a second fluid passage configured to split the single fluid flow into a first split fluid flow and a second split fluid flow, the first fluid passage adapted to carry the first split fluid flow to an inlet of a first cold plate, the second fluid passage adapted to carry the second split fluid flow to an inlet of a second cold plate separate from the first cold plate, wherein the first cold plate and the second cold plate each comprise a respective fluid passage extending therethrough;
- multiple spring mechanisms coupled to the manifold and to each of the first cold plate and the second cold plate, wherein the spring mechanisms are configured to exert a force against the first cold plate and the second cold plate;
- and
- a manifold outlet configured to:
- receive the first split fluid flow from an outlet of the first cold plate;
- receive the second split fluid flow from an outlet of the second cold plate;
- and
- merge the first split fluid flow and the second split fluid flow into a merged fluid flow.
Dependencies are inferred from the claim text.