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US 12,739,947 B2Granted
Electrothermal film structure, electrothermal film heating device and method for manufacturing electrothermal film
AssigneeMicron Optoelectronics Co., Ltd.
InventorsWei Su, Shourong Hu, Guoliang Zhang, Yu Su
Life of this patent
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Abstract
An electrothermal film structure includes a supporting layer, a meshed conductive circuit layer and a transparent optical layer. The meshed conductive circuit layer provided on the supporting layer includes several micron-level conductive circuits distributed in a mesh, and the transparent optical layer is provided on the meshed conductive circuit layer. The meshed conductive circuit layer comprises a plurality of meshed conductive circuit units.
Claims6
An electrothermal film structure, comprising:
- a supporting layer;
- a meshed conductive circuit layer;
- and
- a transparent optical layer,
- wherein the meshed conductive circuit layer provided on the supporting layer comprises several micron-level conductive circuits distributed in a mesh, and the transparent optical layer is provided on the meshed conductive circuit layer;
- the meshed conductive circuit layer comprises a plurality of meshed conductive circuit units provided between the supporting layer and the transparent optical layer, and the plurality of meshed conductive circuit units are connected to an external power supply;
- the meshed conductive circuit layer further comprises a plurality of reserved meshed conductive circuit units;
- a working heating circuit is composed of the plurality of meshed conductive circuit units;
- and
- a plurality of reserved heating circuits are composed of the plurality of reserved meshed conductive circuit units.
7 more elements
Dependencies are inferred from the claim text.