Radio-frequency modules that enhance noise reduction using bypass capacitors in double-sided mounting configurations

A radio-frequency module comprising:

• a module substrate having a first major surface and a second major surface that are opposite to each other;
• a plurality of electronic components disposed at the first major surface and at the second major surface;
• and
• a plurality of external connection terminals disposed at the second major surface, the plurality of external connection terminals including a power supply terminal, wherein
• the plurality of electronic components includes
• a first electronic component disposed at the second major surface, the first electronic component including an active circuit coupled to the power supply terminal, and
• a second electronic component disposed at the second major surface, the second electronic component including a capacitor coupled between a path connecting the power supply terminal to the active circuit and ground, and
• a ground electrode layer within the module substrate, wherein
• at least a portion of the second electronic component overlaps at least a portion of the ground electrode layer in plan view of the module substrate, and
• the second electronic component is disposed closer to the power supply terminal than any other electronic component disposed at the second major surface.

A radio-frequency module comprising:

• a module substrate having a first major surface and a second major surface that are opposite to each other;
• a plurality of electronic components disposed at the first major surface and at the second major surface;
• and
• a plurality of external connection terminals disposed at the second major surface, the plurality of external connection terminals including a power supply terminal, wherein
• the plurality of electronic components includes
• a first electronic component disposed at the second major surface, the first electronic component including an active circuit coupled to the power supply terminal, and
• a second electronic component disposed at the second major surface, the second electronic component including a capacitor coupled between a path connecting the power supply terminal to the active circuit and ground, and
• a ground electrode layer within the module substrate, wherein
• at least a portion of the second electronic component overlaps at least a portion of the ground electrode layer in plan view of the module substrate, and
• the second electronic component is disposed between the power supply terminal and the first electronic component in plan view of the module substrate.