Multilevel inverter system including X-type multilevel converters having mutual inductance cancellation

A multi-phase power inverter for an electric propulsion system, the multi-phase power inverter comprising:

• a plurality of X-type multilevel power converters arranged to transfer electric power between a high-voltage direct current (DC) power source and an electric machine, wherein each of the plurality of X-type multilevel power converters is a solid-state integrated circuit (IC) including:
• a positive DC power bus;
• a negative DC power bus;
• a first alternating current (AC) bus;
• a first auxiliary bus;
• a second auxiliary bus;
• a plurality of semiconductor switches disposed on an insulating substrate board, the plurality of semiconductor switches including a first semiconductor switch, a second semiconductor switch, a third semiconductor switch, and a fourth semiconductor switch;
• a heat sink adjoined to the insulating substrate board via a thermally conductive interface material;
• wherein the first semiconductor switch, the second semiconductor switch, the third semiconductor switch, and the fourth semiconductor switch are connected in series between the positive DC power bus and the negative DC power bus;
• wherein the first semiconductor switch is connected to the second semiconductor switch at a first node, wherein the second semiconductor switch is connected to the third semiconductor switch at a second node, and wherein the third semiconductor switch is connected to the fourth semiconductor switch at a third node;
• wherein the first node is connected to the first auxiliary bus;
• wherein the second node is connected to the first AC power bus;
• and
• wherein the third node is connected to the second auxiliary bus.

An electrified vehicle comprising:

• an electric propulsion system including:
• an electric motor configured to provide power to the electric propulsion system;
• a plurality of X-type multilevel power converters arranged to transfer electric power between a high-voltage direct current (DC) power source and an electric machine, wherein each of the plurality of X-type multilevel power converters is a solid-state integrated circuit (IC) including:
• a positive DC power bus;
• a negative DC power bus;
• a first alternating current (AC) bus;
• a second AC power bus;
• a first clamping diode;
• a second clamping diode;
• a power module substrate disposed on an insulating substrate;
• a heat sink adjacent to a first side of the insulating substrate;
• and
• wherein the power module substrate includes:
• a plurality of semiconductor switches including a first semiconductor switch, a second semiconductor switch, a third semiconductor switch, a fourth semiconductor switch, a fifth semiconductor switch, a sixth semiconductor switch, a seventh semiconductor switch, and an eighth semiconductor switch;
• wherein the first semiconductor switch, the second semiconductor switch, the third semiconductor switch, and the fourth semiconductor switch are connected in series between the positive DC power bus and the negative DC power bus;
• wherein the first semiconductor switch is connected to the second semiconductor switch at a first node, wherein the second semiconductor switch is connected to the third semiconductor switch at a second node, and wherein the third semiconductor switch is connected to the fourth semiconductor switch at a third node;
• wherein the fifth semiconductor switch, the sixth semiconductor switch, the seventh semiconductor switch, and the eighth semiconductor switch are connected in series between the positive DC power bus and the negative DC power bus;
• wherein the fifth semiconductor switch is connected to the sixth semiconductor switch at a fourth node, wherein the sixth semiconductor switch is connected to the seventh semiconductor switch at a fifth node, and wherein the seventh semiconductor switch is connected to the eighth semiconductor switch at a sixth node;
• wherein the first clamping diode is connected between the third node and the fourth node;
• wherein the second clamping diode is connected between the first node and the sixth node;
• wherein the second node is connected to the first AC power bus;
• wherein the fifth node is connected to the second AC power bus;
• wherein each of the plurality of semiconductor switches includes a plurality of lateral semiconductor dies, and wherein each of the plurality of lateral semiconductor dies includes gate control terminals;
• and
• wherein the plurality of semiconductor switches, the first clamping diode, and the second clamping diode are coplanar.