Conductor connecting module having a contact element for soldering on a printed circuit board

A conductor connecting assembly comprising:

• a printed circuit board;
• and
• a conductor connecting module, the conductor connecting module comprising:
• an insulating housing;
• a contact insert arranged in the insulating housing, the contact insert comprising a busbar and a clamping spring;
• and
• at least one contact element having a solder connection contact surface being arranged on the busbar, the solder connection contact surface being able to be soldered on the printed circuit board,
• wherein the busbar is a frame-shaped busbar, the frame-shaped busbar comprising a contact section and a holding section that are formed opposite each other the contact section and the holding section being connected to each other via a connecting section,
• wherein the clamping spring has a contact leg to contact the holding section and a clamping leg, the clamping leg and the contact section forming a clamping point for an electrical conductor to be clamped,
• wherein the at least one contact element is arranged on the holding section and/or on the connecting section and/or on the contact section,
• wherein the solder connection contact surface of the at least one contact element protrudes from an opening of the insulating housing,
• wherein the at least one contact element includes a first contact element arranged on the holding section and a second contact element arranged on the contact section, wherein the opening of the insulating housing includes a first opening and a second opening, and wherein the first contact element protrudes from the first opening and the second contact element protrudes from the second opening in the insulating housing.

A conductor connecting assembly comprising:

• a printed circuit board;
• and
• a conductor connecting module, the conductor connecting module comprising:
• an insulating housing;
• a contact insert arranged in the insulating housing, the contact insert comprising a busbar and a clamping spring;
• and
• at least one contact element having a solder connection contact surface being arranged on the busbar the solder connection contact surface being able to be soldered on the printed circuit board,
• wherein the busbar is a frame-shaped busbar, the frame-shaped busbar comprising a contact section and a holding section that are formed opposite each other the contact section and the holding section being connected to each other via a connecting section,
• wherein the clamping spring has a contact leg to contact the holding section and a clamping leg, the clamping leg and the contact section forming a clamping point for an electrical conductor to be clamped,
• wherein the at least one contact element is arranged on the holding section and/or on the connecting section and/or on the contact section,
• wherein the solder connection contact surface of the at least one contact element protrudes from an opening of the insulating housing, and
• wherein the printed circuit board is arranged in a housing, the conductor connecting module being insertable into a recess of the housing.

A conductor connecting module comprising:

• an insulating housing;
• a contact insert arranged in the insulating housing, the contact insert comprising a busbar and a clamping spring;
• and
• at least one contact element having a solder connection contact surface being arranged on the busbar, the solder connection contact surface being able to be soldered on a printed circuit board,
• wherein the busbar is a frame-shaped busbar, the frame-shaped busbar comprising a contact section and a holding section that are formed opposite each other, the contact section and the holding section being connected to each other via a connecting section,
• wherein the clamping spring has a contact leg to contact the holding section and a clamping leg, the clamping leg and the contact section forming a clamping point for an electrical conductor to be clamped,
• wherein the at least one contact element is arranged on the connecting section,
• wherein the solder connection contact surface of the at least one contact element protrudes from an opening of the insulating housing,
• wherein the connecting section has an offset formed by at least one bend in the connecting section, and
• wherein the solder connection contact surface of the at least one contact element projects out of a plane of the offset of the connecting section.