Substrate treatment apparatus and substrate treatment method
AssigneePsk Inc.
InventorsA Ram Kim, Jong Woo Park
Life of this patent
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Abstract
The present invention provides an apparatus for treating a substrate. The apparatus for treating a substrate may include: a process treatment unit that provides a treatment space in which the substrate is treated; and a plasma generation unit that is provided above the process treatment unit and generates plasma from a process gas. The plasma generation unit includes: a plasma chamber having an electric discharge space formed therein; a shield unit surrounding the exterior of the plasma chamber; an antenna which surrounds the shield unit from the outside of the shield unit and to which high-frequency power is applied; and a connecting unit electrically connecting the shield unit and the antenna.
Claims18
An apparatus for treating a substrate, the apparatus comprising:
- a process treatment unit for providing a treatment space in which the substrate is treated;
- and
- a plasma generation unit provided above the process treatment unit to generate plasma from process gas,
- wherein the plasma generation unit includes:
- a plasma chamber having a discharge space formed therein;
- a shield unit surrounding an exterior of the plasma chamber;
- an antenna which surrounds the shield unit from an outside of the shield unit and to which high frequency power is applied;
- and
- a connecting unit for electrically connecting the shield unit to the antenna such that high frequency voltage from the antenna is applied to the shield unit to improve initial discharge efficiency, and
- wherein the connecting unit is movably provided along a longitudinal direction of the antenna.
An apparatus for treating a substrate, the apparatus comprising:
- a process treatment unit for providing a treatment space in which the substrate is treated;
- and
- a plasma generation unit provided above the process treatment unit to generate plasma from process gas,
- wherein the plasma generation unit includes:
- a plasma chamber having a discharge space formed therein;
- a shield unit surrounding an exterior of the plasma chamber;
- an antenna which surrounds the shield unit from an outside of the shield unit and to which high frequency power is applied;
- and
- a connecting unit for electrically connecting the shield unit to the antenna such that high frequency voltage from the antenna is applied to the shield unit to improve initial discharge efficiency,
- wherein the shield unit includes:
- a first shield member surrounding one side of the plasma chamber along a circumference direction of the plasma chamber;
- and
- a second shield member facing the first shield member and surrounding an other side opposite the one side of the plasma chamber, and
- the first shield member and the second shield member are combined with each other to surround an outer surface of the plasma chamber,
- wherein the first shield member and the second shield member are electrically isolated from each other, and
- wherein a power terminal to which high frequency power is applied is formed at an upper end of the antenna, and a ground terminal that is grounded is formed at a lower end of the antenna, and
- the connecting unit includes:
- a first connecting member that electrically directly connects a first point of the antenna and the first shield member;
- and
- a second connecting member that electrically directly connects a second point of the antenna and the second shield member, and
- a distance from the first point to the power terminal and a distance from the second point to the power terminal are provided differently.
An apparatus for treating a substrate, the apparatus comprising:
- a chamber for providing a plasma generation region;
- an antenna disposed adjacent to the chamber, and including a power terminal to which high frequency power is applied and a ground terminal that is grounded;
- a shield unit disposed between the chamber and the antenna;
- and
- a connecting unit for electrically connecting the shield unit to the antenna such that high frequency voltage from the antenna is applied to the shield unit to improve initial discharge efficiency,
- wherein the connecting unit is movably provided along a longitudinal direction of the antenna.
Dependencies are inferred from the claim text.