Power inductor, preparation method of power inductor, and system in package module

A system in package module, comprising:

• a circuit board;
• and
• a power inductor disposed on the circuit board, wherein the power inductor comprises:
• a winding comprising:
• a body structure comprising a first end and a second end;
• a first connection structure connected to the first end and comprising a first pin;
• and
• a second connection structure connected to the second end and comprising a second pin and a third pin, wherein the winding comprises a stamped bare copper sheet;
• and
• a metal magnetic powder core that is pressed to the winding,
• wherein the metal magnetic powder core is insulated from the winding,
• wherein the first connection structure extends to a first external surface of the metal magnetic powder core,
• wherein the second connection structure extends to a second external surface of the metal magnetic powder core as the second pin and extends to the first external surface of the metal magnetic powder core as the third pin,
• wherein the first pin and the third pin are exposed on the first external surface, and
• wherein the second pin is exposed on the second external surface.