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US 12,737,118 B2Granted
Photonic memory fabric for system memory interconnection
AssigneeSicily Merger Sub II, Inc.
InventorsDavid Lazovsky, Philip Winterbottom, Martinus Bos
Life of this patent
Estimating the term…
Abstract
One embodiment is a method that includes generating a request for a data item in a memory, obtaining the data item from the memory with a photonic interface, sending the data item to a fabric using a transmit unit of the photonic interface, and routing the data item through a portion of the fabric coupled to the memory, the portion of the fabric including one or more additional transmit and receive units between the photonic interface and a destination receive unit.
Claims14
A system-in-package, comprising:
- a computing resource;
- and
- an interface associated with the computing resource, the interface comprising:
- a first transmit unit for sending data from the computing resource via a first optical link, wherein the first transmit unit comprises a driver connected to a modulator, and a serializer, the driver being disposed in a photonic-integrated circuit (PIC) and connected to the serializer, wherein the serializer provides an output to the driver;
- a first receive unit for receiving data sent to the computing resource via a second optical link, wherein the first receive unit comprises a photodetector a deserializer;
- at least one additional transmit unit for sending data from the computing resource via a first one or more additional optical links of a bidirectional channel and at least one additional receive unit for receiving data sent to the computing resource via a second one or more additional optical links of the bidirectional channel;
- and
- a transmit bonding engine for splitting the data sent from the computing resource across the first optical link and the first one or more additional optical links and a receive bonding engine for assembling received data sent to the computing resource across the second optical link and the second one or more additional optical links.
5 more elements
A system-in-package, comprising:
- a first computing resource;
- a second computing resource;
- and
- a fabric coupled to the first computing resource and the second computing resource, the fabric comprising:
- a first interface associated with the first computing resource, the first interface comprising:
- a first transmit unit for sending data from the first computing resource via a first optical link of a bidirectional channel, the first transmit unit comprising a first driver connected to a first modulator, the first driver and the first modulator being implemented in a photonic integrated circuit (PIC), and a first serializer in a first electronic integrated circuit (EIC), the first driver being connected to the first serializer, wherein the first serializer provides a first output to the first driver;
- and
- a first receive unit for receiving data sent to the first computing resource via a second optical link of the bidirectional channel, the first receive unit comprising a photodetector in the PIC, and a first deserializer in the first EIC;
- at least one additional transmit unit for sending data from the first computing resource via a first one or more additional first optical links of the bidirectional channel;
- at least one additional first receive unit for receiving data sent to the first computing resource via a second one or more additional first optical links of the bidirectional channel;
- a transmit bonding engine for splitting the data sent from the first computing resource across the first optical link and the first one or more additional optical links;
- and
- a receive bonding engine for assembling received data sent to the first computing resource across the second optical link and the second one or more first additional optical links;
- a second interface associated with the second computing resource, the second interface comprising:
- a second transmit unit for sending data from the second computing resource via the second optical link of the bidirectional channel, the second transmit unit comprising a second driver connected to a second modulator, the second driver and the second modulator being implemented in the PIC, and a second serializer in a second EIC, the second driver being connected to the second serializer, wherein the second serializer provides a second output to the second driver;
- and
- a second receive unit for receiving data sent to the second computing resource via the first optical link of the bidirectional channel, the second receive unit comprising a second photodetector in the PIC, and a second deserializer in the second EIC.
14 more elements
Dependencies are inferred from the claim text.