Touch sensor panel with reduced dimensions

A touch and force sensor panel, comprising:

• a substrate;
• a plurality of conductive layers including a first conductive layer, a second conductive layer, and a third conductive layer;
• a plurality of vias from the first conductive layer and the third conductive layer to the second conductive layer;
• and
• control circuitry mounted to a printed circuit;
• wherein:
• the control circuitry includes touch sensing circuitry and force sensing circuitry;
• the first conductive layer includes a plurality of touch electrodes;
• the touch and force sensor panel includes a plurality of force electrodes disposed on a layer of the plurality of conductive layers different than the first conductive layer;
• the second conductive layer is separated from the substrate by the first conductive layer and the third conductive layer, and includes a bonding region with a plurality of bond pads for interconnection with the plurality of touch electrodes;
• and
• the printed circuit is separated from the substrate by at least the plurality of conductive layers and is bonded to the plurality of bond pads by a conductive bonding material between the second conductive layer and the printed circuit.

An electronic device, comprising:

• an energy storage device;
• wireless communication circuitry;
• a display;
• and
• a touch sensor panel, comprising:
• a substrate;
• a plurality of conductive layers including a first conductive layer and a second conductive layer;
• a plurality of vias from the first conductive layer to the second conductive layer;
• and
• control circuitry mounted to a printed circuit;
• wherein:
• the control circuitry includes touch sensing circuitry;
• the first conductive layer includes a plurality of touch electrodes;
• the touch sensor panel includes a plurality of force electrodes disposed on a layer of the plurality of conductive layers different than the first conductive layer;
• the second conductive layer is separated from the substrate by at least the first conductive layer and includes a bonding region with a plurality of bond pads for interconnection with the plurality of touch electrodes;
• and
• the printed circuit is separated from the substrate by at least the plurality of conductive layers and is bonded to the plurality of bond pads by a conductive bonding material between the second conductive layer and the printed circuit.