Multi-die system performance optimization
AssigneesATI Technologies ULC, Advanced Micro Devices, Inc.
InventorsGreg Sadowski, Sriram Sundaram, Stephen Kushnir, William C. Brantley, Michael J. Schulte
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AssigneesATI Technologies ULC, Advanced Micro Devices, Inc.
InventorsGreg Sadowski, Sriram Sundaram, Stephen Kushnir, William C. Brantley, Michael J. Schulte
Estimating the term…
A multi-die semiconductor package includes a first integrated circuit (IC) die having a first intrinsic performance level and a second IC die having a second intrinsic performance level different from the first intrinsic performance level. A power management controller distributes, based on a determined die performance differential between the first IC die and the second IC die, a level of power allocated to the semiconductor chip package between the first IC die and the second IC die. In this manner, the first IC die receives and operates at a first level of power resulting in performance exceeding its intrinsic performance level. The second IC die receives and operates at a second level of power resulting in performance below its intrinsic performance level, thereby reducing performance differentials between the IC dies.
A semiconductor chip package, comprising:
A method, comprising:
A non-transitory computer readable medium embodying a set of executable instructions, the set of executable instructions to manipulate at least one processor to:
Dependencies are inferred from the claim text.