Substrate treating apparatus and substrate treating method
AssigneeSemes Co., Ltd.
InventorsSe Won Kim, Chung Woo Lee, Ji Won Cha
Life of this patent
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AssigneeSemes Co., Ltd.
InventorsSe Won Kim, Chung Woo Lee, Ji Won Cha
Estimating the term…
The substrate treating apparatus includes an analysis part configured to communicate with a measurement unit to be input with an information with respect to a boundary, to calculate a center coordinate value of a substrate and a center coordinate value of a support unit with an input information on the boundary, to set a calculated center coordinate value of the support unit as a center coordinate value of the measurement unit, to set a calculated center coordinate value of the substrate as a center coordinate value of a transfer robot, to record the center coordinate value of the transfer robot on a plane coordinate system of the measurement unit, and to convert a recorded center coordinate value of the transfer robot and a center coordinate value of the measurement unit to a plane coordinate system of the transfer robot to teach the transfer robot.
A substrate treating apparatus, comprising:
A substrate treating apparatus comprising:
Dependencies are inferred from the claim text.