Calculation device and method for extracting feature of measurement data by using same

A non-transitory computer-readable recording medium having contents configured to cause a computing system to perform a method, the method comprising:

• identifying measurement data obtained during a process of coating a substrate;
• identifying target data related to the measurement data, the target data indicating a selected coating height;
• performing a computation on the measurement data based on the target data;
• extracting a plurality of first values by applying a max pooling layer to the computed measurement data;
• extracting a plurality of second values by applying a min pooling layer to the computed measurement data;
• extracting a plurality of third values related to a feature of the measurement data using the plurality of first values and the plurality of second values;
• identifying an anomaly that occurred during the process based on the plurality of third values;
• providing information for inspection of the process based on a region where the anomaly was identified;
• and
• manufacturing the substrate of the semiconductor such that the coating has a uniform height at each position of the substrate based on the provided information for inspection.

A computing apparatus for extracting a feature of measurement data, the computing apparatus comprising:

• a memory in which a computer-readable instruction is stored;
• and
• a processor connected to the memory,
• wherein the processor is configured to:
• identify the measurement data obtained during a process for applying a substrate treatment to a semiconductor, wherein the process for applying the substrate treatment to the semiconductor includes the process of coating a substrate of the semiconductor;
• identify target data related to the measurement data, the target data including a selected coating height;
• perform a computation on the measurement data based on the target data;
• extract a plurality of first values by applying a max pooling layer to the computed measurement data;
• extract a plurality of second values by applying a min pooling layer to the computed measurement data;
• extract a plurality of third values related to a feature of the measurement data using the plurality of first values and the plurality of second values;
• identify an anomaly that occurred during the process based on the plurality of third values;
• provide information for inspection of the process based on a region where the anomaly was identified;
• and
• manufacture the substrate of the semiconductor such that the coating has a uniform height at each position of the substrate of the semiconductor based on the provided information for inspection.