High-precision resonator gyroscope and manufacturing process thereof

A manufacturing process of a high-precision resonator gyroscope, comprising:

• obtaining a resonator substrate from fused quartz material, and further comprising the following steps:
• Step 1. Model design:
• detecting changes in external angles by using an azimuth of a wave pattern in a second-order bending mode of a hemispherical resonator to construct a manufacturing model, introducing a shaft system dynamic balancing and polishing process into the manufacturing model, and performing polishing operation to obtain a polished substrate;
• step 2. mass trimming:
• calculating a trimming amount for the polished substrate by the manufacturing model, and performing trimming operation according to the trimming amount to obtain a trimmed substrate;
• step 3. assembly and packaging:
• assembling and packaging the trimmed substrate in the step 2, an excitation cover, a base and an electrode unit to obtain a gyroscope;
• step 4. testing and compensation:
• performing precision detection on the gyroscope in the step 3, and performing error compensation according to a precision detection result;
• wherein
• the resonator substrate is provided with a windowing structure, a manufacturing system comprises a polishing module, a fixture module and a balancing module, and a polishing cavity is arranged at an end part of the polishing module;
• the shaft system dynamic balancing and polishing process is as follows:
• when being in an initial state, the resonator substrate is placed on the fixture module, an outer surface of the resonator substrate is attached to an opening of the polishing cavity, the balancing module releases balancing flow to an inner surface of the resonator substrate and enables the resonator substrate to rotate through the windowing structure;
• and after the resonator substrate keeps dynamic balance, the balancing module switches the balancing flow into polishing flow to pass through the windowing structure, and polishing operation on the inner surface of the resonator substrate is completed through continuous flowing of the polishing flow;
• after the resonator substrate maintains dynamic balance, the fixture module cancels the clamping effect on the resonator substrate, and in this case, the resonator substrate maintains dynamic balance through power brought by the polishing flow continuously released by the balancing module;
• in the step 1, the construction of the manufacturing model is as follows:
• step 1-1:
• the angle changes are detected by changes in the azimuth of the wave pattern in the second-order bending mode of the hemispherical resonator, and the angle change process follows θ(t)=−kφ(t)+β(t);
• k is a proportional coefficient;
• β(t) is a zero-position drift rate;
• φ(t) is an angle change;
• θ(t) is a precession angle;
• step 1-2:
• frequency splitting of the second-order bending mode is defined as a difference between natural frequencies of two basic vibration modes of the resonator, and the definition process follows:
• Δω=ω21−ω22;
• Δω represents the frequency splitting;
• ω21 represents natural frequency of one basic vibration mode;
• ω22 represents natural frequency of the other basic vibration mode;
• step 1-3:
• a relationship between the frequency splitting and mass distribution is determined by theory of solid-state wave gyroscope, and the relationship follows:
• Δ
• ⁢
• ω
• =
• λ
• ⁢
• ρ
• 4
• ;
• λ represents a proportional coefficient;
• ρ4 represents a fourth harmonic amplitude in a circumferential direction;
• step 1-4:
• a sensitivity of i-th trimming is defined as a derivative of the frequency splitting to the trimming amount, and the definition process follows:
• S
• mi
• =
• ∂
• Δ
• ⁢
• ω
• ∂
• Δ
• ⁢
• mi
• ;
• Smi represents the sensitivity;
• Δmi represents the trimming amount;
• step 1-5:
• an objective function and constraints of the manufacturing model are defined, the objective function is to minimize the frequency splitting and follows:
• minΔmiΔω;
• the constraints comprise the sensitivity, trim angles, the trimming amount and a process capability coefficient, and the constraint process follows:
• s
• .
• t
• ⁢
• 0
• <
• S
• mi
• ⁢
• θ
• i
• ⁢
• ϕ
• i
• <
• Δ
• ⁢
• ω
• <
• Δ
• ⁢
• ω
• max
• ;
• s
• .
• t
• ⁢
• Cp
• >
• 1.33
• .
• ;
• θi, φi both represent the trim angles;
• Cp represents the process capability coefficient;
• and
• Δωmax represents a maximum frequency splitting amount allowed under manufacturing requirements.