Solid-state imaging device, method for manufacturing cover glass, and electronic apparatus
AssigneeSony Semiconductor Solutions Corporation
InventorsKatsunori Takahashi, Shoichi Hirooka
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AssigneeSony Semiconductor Solutions Corporation
InventorsKatsunori Takahashi, Shoichi Hirooka
Estimating the term…
A solid-state imaging device with high versatility having a cavity-less CSP structure capable of reducing the occurrence of flare and also being applied to chip size reduction, a method for manufacturing a cover glass, and an electronic apparatus. A solid-state imaging device includes: a sensor substrate in which a plurality of pixels is arranged; a semiconductor substrate having an upper surface on which the sensor substrate is mounted, the semiconductor substrate being configured to connect an electric signal converted by the pixel to a bump or an external connection terminal disposed on a lower surface; a microlens array disposed on an upper surface of the sensor substrate; a resin disposed on an upper surface of the microlens array; and a cover glass bonded to the microlens array via the resin and having a moth-eye structure on a surface of the cover glass.
A solid-state imaging device, comprising:
A method for manufacturing a cover glass having a moth-eye structure, the method comprising:
An electronic apparatus, comprising:
Dependencies are inferred from the claim text.