Molded sensor assembly
AssigneeMerit Medical Systems, Inc.
InventorsRick Russell, Jonathan Cheney, Scott Brown, Luca Salmaso, Aaron Hopkinson
Life of this patent
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Abstract
A molded sensor assembly for measuring parameters in a given circumstance. The molded sensor assembly includes a housing with one or more apertures that extends from an upper surface to a lower surface of the housing. A lower surface of the housing is coupled to an upper surface of a printed circuit board member. A sensor is disposed within the housing, the sensor comprising wires that are coupled to the printed circuit board member. Each wire extends through an aperture of the housing.
Claims19
A molded sensor assembly comprising:
- a housing comprising a first aperture that extends from an upper surface to a lower surface of the housing;
- a printed circuit board member coupled to the lower surface of the housing;
- and
- a sensor disposed with the housing, the sensor comprising a first wire that is electrically coupled to the printed circuit board member,
- wherein the first wire extends through a first sidewall to an opposing sidewall of the first aperture, and
- wherein the housing further comprises a second aperture that extends from the upper surface to the lower surface of the housing.
A method of manufacturing a molded sensor assembly comprising:
- obtaining a housing comprising:
- a first aperture that extends from an upper surface of the housing to a lower surface of the housing;
- a second aperture that extends from the upper surface of the housing to the lower surface of the housing;
- and
- a sensor disposed within the housing with a first wire and a second wire that extend through the housing,
- wherein the first wire extends through a first sidewall to an opposing sidewall of the first aperture a predetermined distance above the lower surface of the housing and the second wire extends through a second sidewall to an opposing sidewall of the second aperture a predetermined distance above the lower surface of the housing, and
- wherein the housing further comprises a second aperture that extends from the upper surface to the lower surface of the housing;
- obtaining a printed circuit board member with a first electrical contact and a second electrical contact and configured to electrically connect the first wire of the sensor to the first electrical contact of the printed circuit board member and the second wire of the sensor to the second electrical contact of the printed circuit board member;
- and
- coupling the lower surface of the housing to the printed circuit board member, wherein the first electrical contact is aligned with the first aperture of the housing and the second electrical contact is aligned with the second aperture of the housing.
Dependencies are inferred from the claim text.