Multilayer body and electronic component formed of same

A laminate body, comprising:

• a base material;
• and
• a curable hot melt silicone composition layer in contact with the base material;
• wherein the curable hot melt silicone composition includes an organopolysiloxane resin containing a siloxane unit selected from a group including a siloxane unit expressed by R1SiO3/2 where R1 indicates an independent substituted or unsubstituted alkyl group or substituted or unsubstituted aryl group, and a siloxane unit expressed as SiO4/2 making up at least 20 mol % or more of all siloxane units;
• wherein the melt viscosity of the curable hot melt silicone composition as measured by a flow tester at a pressure of 2.5 MPa at 100° C. is 500 Pa·s or less;
• wherein the curable hot melt silicone composition includes at least:
• (A) an organopolysiloxane resin containing a siloxane unit expressed by SiO4/2 making up at least 20 mol % or more of all siloxane units, and
• (B) a straight or branched chain organopolysiloxane that is liquid or has plasticity at 25° C.;
• and
• wherein component (A) comprises:
• (A1′) an organopolysiloxane resin containing a curing reactive functional group including a carbon-carbon double bond in the molecule and containing a siloxane unit expressed by SiO4/2 making up at least 20 mol % of all siloxane units, that does not independently have hot-melt properties and is solid at 25° C.;
• and
• (A2′) an organopolysiloxane resin that does not have a curing reactive functional group containing a carbon-carbon double bond in the molecule while containing a siloxane unit expressed by SiO4/2 making up at least 20 mol % or more of all siloxane units, that does not independently have hot-melt characteristics and is solid at 25° C.