Resin composition, molded body, and film
AssigneeKaneka Corporation
InventorsKohei Ogawa, Fumiyasu Ishiguro
Life of this patent
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Abstract
A resin composition including a polyamideimide and an acryl-based resin is provided. The polyamideimide has a diamine-derived structure, a tetracarboxylic-dianhydride-derived structure and a dicarboxylic-acid-derived structure, and contains a structure derived from a fluoroalkyl-substituted benzidine as the diamine-derived structure. A ratio of the dicarboxylic-acid-derived structure relative to the total of the tetracarboxylic-dianhydride-derived structure and the dicarboxylic-acid-derived structure of the polyamideimide may be 5 to 80 mol %. The resin composition may be used for production of formed article such as film.
Claims15
A resin composition comprising:
- a polyamideimide;
- and an acryl-based resin, wherein
- the polyamideimide has an imide structure which is formed via bonding between a diamine-derived structure represented by general formula (IIIa) and a tetracarboxylic-dianhydride-derived structure represented by general formula (IVa), and an amide structure which is formed via bonding between the diamine-derived structure represented by general formula (IIIa) and a dicarboxylic-acid-derived structure represented by general formula (Va),
- wherein Y is a divalent organic group and is a diamine residue, X is a tetravalent organic group and is a tetracarboxylic dianhydride residue, and Z is a divalent organic group and is a dicarboxylic acid residue,
- wherein the polyamideimide contains a structure derived from a fluoroalkyl-substituted benzidine as the diamine-derived structure.
Dependencies are inferred from the claim text.