MEMS die and MEMS-based vibration sensor
AssigneeKnowles Electronics, LLC
InventorsKen Deng, Michael Pedersen, Richard Li-Chen Chen, Shubham Shubham, Faisal Zaman
Life of this patent
Estimating the term…
Loading patent…
AssigneeKnowles Electronics, LLC
InventorsKen Deng, Michael Pedersen, Richard Li-Chen Chen, Shubham Shubham, Faisal Zaman
Estimating the term…
A vibration sensor/accelerometer includes, in various implementations, a MEMS die that includes a plate having an aperture, an anchor disposed within the aperture, a plurality of arms (e.g., rigid arms) extending from the anchor, and a plurality of resilient members (e.g., looped or folded springs with a carefully designed spring stiffness), each resilient member connecting the plate to an arm of the plurality of arms. The plate may be made from a solid layer in which the resilient members are etched from the same layer. The MEMS die may also include top and bottom wafers, and travel stoppers extending from the top and bottom wafers as well as through the plate.
A microelectromechanical systems (MEMS) die comprising:
A microelectromechanical systems (MEMS) die comprising:
A microelectromechanical systems (MEMS) die comprising:
Dependencies are inferred from the claim text.