Substrate treating control method, substrate treating apparatus, substrate treating method and computer program stored in computer readable medium for treating substrate

A substrate treating control method, performed by a substrate treating apparatus, the substrate treating control method comprising:

• configuring the substrate treating apparatus that includes a printing device, a maintenance device, a first gantry, a second gantry, and a head, the printing device configured to perform printing on a target substrate, the maintenance device configured to check a state of the head and perform cleaning on the head, the printing device and the maintenance device extending in a first horizontal direction and arranged side by side in a second horizontal direction perpendicular to the first horizontal direction, the first gantry and the second gantry extending over both the printing device and the maintenance device in the second horizontal direction and spaced spart from each other in the first horizontal direction, the head movably coupled to the first gantry and the second gantry and configured to move along the second horizontal direction,
• discharging, by a nozzle included in the head, a droplet to a dummy substrate placed on the maintenance device in each of a plurality of discharge cycles while changing a relative position of the substrate to the head in a horizontal direction at regular time intervals and at a speed,
• obtaining reference data, in each of the plurality of discharge cycles, based on a difference between a discharge position of the nozzle at a discharge time of the droplet in each of the plurality of discharge cycles when viewed from above and an impact position on the substrate of the droplet;
• predicting a number of one or more initial discharge cycles before reaching a convergence discharge cycle based on the reference data;
• and
• applying a correction value to correct a droplet discharge timing of the nozzle during each of the one or more initial discharge cycles,
• wherein the one or more initial discharge cycles is one or more of the discharge cycles before the convergence discharge cycle, and
• the convergence discharge cycle is a discharge cycle immediately after a last one of the one or more initial discharge cycles, from among the plurality of discharge cycles, and after the convergence discharge cycle, a falling position variance between the discharge position and the impact position becomes constant.