Electrostatically-enhanced friction-gripping end effector
AssigneesDiablo Capital, Inc., Kawasaki Robotics (USA), Inc.
InventorsEryn Smith, Charles Maschal, Avish Bharwani
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AssigneesDiablo Capital, Inc., Kawasaki Robotics (USA), Inc.
InventorsEryn Smith, Charles Maschal, Avish Bharwani
Estimating the term…
An electrostatically-enhanced friction-gripping end effector is an apparatus that quickly and securely moves a semiconductor wafer from one spot to another spot. The apparatus includes a flat effector body, an electrostatic antenna, an antenna controller, and a plurality of gripping pads. The flat effector body is the main weight-bearing structure that is used to support the semiconductor wafer and acts as a base for the other components to be connected together. The electrostatic antenna generates a non-uniform electrostatic field that applies an attractive force onto the semiconductive wafer, while the plurality of gripping pads frictionally grips the semiconductive wafer. The antenna controller provides instructions to turn on, turn off, or modulate the non-uniform electrostatic field.
An electrostatically-enhanced friction-gripping end effector comprising:
Dependencies are inferred from the claim text.