Laser processing apparatus

A laser processing apparatus comprising:

• a holding table that holds a workpiece;
• a laser beam irradiation unit that focuses a pulsed laser beam and irradiates the workpiece held on the holding table with the laser beam to execute processing and forms laser-processed grooves in the workpiece;
• and
• a movement unit that relatively moves the holding table and a focal point of the laser beam, the movement unit being configured to move the holding table and the focal point of the laser beam in a processing feed (X-axis) direction, wherein
• the laser beam irradiation unit includes
• a laser oscillator,
• a first splitting unit that causes the laser beam emitted from the laser oscillator to branch into a first optical path and a second optical path,
• a first beam condenser that focuses the laser beam having been introduced to the first optical path,
• a second beam condenser that focuses the laser beam having been introduced to the second optical path,
• a second splitting unit that is disposed on the first optical path between the first splitting unit and the first beam condenser and that splits the laser beam having been introduced to the first optical path into at least two laser beams, and
• a laser beam scanning unit that is disposed on the second optical path between the first splitting unit and the second beam condenser and that executes scanning with the laser beam having been introduced to the second optical path and introduces the laser beam to the second beam condenser.