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US 12,734,597 B2Granted
Cut member processing device and cutting system
AssigneesAmada Company, Limited, Amada Machinery Co., Ltd.
InventorShoji Aihara
Life of this patent
Estimating the term…
Abstract
A cut member processing device includes a marking device configured to put a mark on a cut surface of a cut member cut out from a metal long workpiece by a cutting device; and a product length acquisition unit configured to measure and store a product length of the cut member. The product length acquisition unit is configured to measure the product length under a state where the cut member is located at a position that allows the marking device to put the mark on the cut surface.
Claims4
A cut member processing device, comprising:
- a table main body that is movable vertically and on which a cut member, which is cut out from a metal long workpiece by a cutting device, is to be placed so that a cut surface of the cut member is directed upward;
- a laser marking device configured to put a mark on the cut surface of the cut member placed on the table main body;
- and
- a product length measuring device provided with a position sensor for detecting the cut surface located at a predetermined marking position, the product length measuring device being configured to determine a product length of the cut member based on the predetermined marking position and a vertical position of the table main body when the position sensor detects the cut surface located at the predetermined marking position,
- a vertical focal point position of a laser beam emitted from the laser marking device is set at the predetermined marking position.
2 more elements
Dependencies are inferred from the claim text.