Field in-place film-covering fermentation device

A field in-place film-covering fermentation device, comprising:

• a support structure comprising a cylindrical wire mesh and metal plates fixedly attached to opposite ends of the wire mesh;
• a covering film, wherein the covering film is pre-divided into three separable segments consisting of an upper surface segment, a lower surface segment, and a side elevation segment, wherein the three segments are configured to collectively wrap around the support structure to form a columnar enclosure enclosing a compost material;
• and the support structure is connected to the covering film through cross-connecting rings on the covering film to form a columnar pile structure;
• fasteners, configured to releasably connect adjacent edges of the three segments to one another, thereby forming a sealed enclosure around the support structure;
• and
• a ventilation structure, comprising a non-power wind cap, an electric air valve, a perforated perforated polyvinyl chloride (PVC) pipe, a temperature sensing probe, and a control circuit;
• wherein the non-power wind cap, the electric air valve and the perforated PVC pipe are sequentially connected in that order and placed vertically above the columnar pile structure, the temperature sensing probe is disposed inside the columnar pile structure;
• and the control circuit is individually connected to the temperature sensing probe and the electric air valve, such that a chimney effect is generated to passively draw air through the compost material without any external power source.