Cleaning device for wafer-suction chuck mechanism
AssigneeTokyo Seimitsu Co., Ltd.
InventorJunichi Fukushima
Life of this patent
Estimating the term…
Abstract
A cleaning device for a wafer-suction chuck mechanism capable of automatically and simply performing cleaning treatment on a chuck surface that suction-holds a wafer and cleaning treatment on a frame suction-holding section. The cleaning device is configured to include a scraper 17 and a brush 18 that press frame suction-holding section cleaning means 10B for removing a sludge on a frame suction-holding section 11B onto the frame suction-holding section 11B, and a water nozzle 19 that discharges and supplies water onto the frame suction-holding section 11B.
Claims5
A cleaning device for a wafer-suction chuck mechanism, that the wafer-suction chuck mechanism comprising a wafer-suction chuck section which suction-holds a wafer attached to a ring frame with an adhesive film interposed therebetween and a frame suction-holding section which is formed annular and suction-holds the ring frame outside the wafer-suction chuck section, the wafer-suction chuck section and the frame suction-holding section rotate along a rotation direction, the cleaning device comprising:
- frame suction-holding section cleaning means that comprises a scraper and a brush capable of contacting the frame suction-holding section and a water nozzle that discharges water onto the frame suction-holding section,
- position movement means that moves the frame suction-holding section cleaning means to the frame suction-holding section, and bring the scraper and the brush into contact with the frame suction-holding section that is rotating,
- wherein the water nozzle, the brush, and the scraper are arranged in the order from an upstream side towards a downstream side in the rotation direction of the frame suction-holding section.
Dependencies are inferred from the claim text.