Packaged current sensor integrated circuit

A current sensor integrated circuit package comprising:

• a primary conductor having an input portion into which a current flows, an output portion from which the current flows, and an exposed portion, wherein the input portion has a reduced area edge and the output portion has a reduced area edge;
• a plurality of secondary leads, each having an exposed portion spaced from the exposed portion of the primary conductor by an isolation distance of at least 2.0 mm, wherein an elongated portion of each of the plurality of secondary leads is offset with respect to the exposed portion of the respective secondary lead;
• a semiconductor die disposed adjacent to the primary conductor and positioned on an insulator portion;
• at least one magnetic field sensing element supported by the semiconductor die;
• and
• a package body comprising a first portion enclosing the semiconductor die and a portion of the primary conductor and a second portion enclosing the elongated portion of the plurality of secondary leads, wherein the first portion of the package body has a first width configured to expose the input portion of the primary conductor and the output portion of the primary conductor and wherein the second portion of the package body has a second width between a first side edge of the package body and a second side edge of the package body that is larger than the first width,
• wherein the package body is singulated along the reduced area edge of the input portion of the primary conductor and along the reduced area edge of the output portion of the primary conductor.