Package structure and manufacturing method thereof

A manufacturing method of a package structure, comprising:

• disposing an IC die in a cavity of a carrier substrate, wherein a thermally conductive layer lining the cavity of the carrier substrate is interposed between the IC die and the carrier substrate;
• forming a redistribution structure on a front side of the carrier substrate;
• forming an antenna pattern over the redistribution structure, wherein the antenna pattern is electrically coupled to the IC die through the redistribution structure;
• forming a patterned dielectric layer on a back side of the carrier substrate;
• forming an underfill on the patterned dielectric layer, wherein the underfill passes through the patterned dielectric layer to be in contact with the back side of the carrier substrate, and the underfill is dispensed outward beyond a boundary of the carrier substrate.

A manufacturing method of a package structure, comprising:

• disposing an IC die in a cavity of a carrier substrate, wherein the carrier substrate comprises an upper surface, a lower surface opposite to the upper surface, and the cavity recessed at the upper surface, and the IC die is thermally coupled to the carrier substrate;
• sequentially forming a redistribution structure and an antenna pattern on the upper surface of the carrier substrate and the IC die, wherein the antenna pattern is electrically coupled to the IC die through the redistribution structure;
• forming a patterned dielectric layer on the lower surface of the carrier substrate, wherein at least a portion of the lower surface of the carrier substrate is exposed by the patterned dielectric layer;
• and
• forming an underfill on the patterned dielectric layer to be in thermal contact with the portion of the lower surface of the carrier substrate, wherein the underfill extends outward to cover a sidewall of the carrier substrate.